Splayed Configuration

Moderate Configuration

Sparse Configuration

PRODUCTS

BGA HEAT SINKS

OVERVIEW

Cool Innovations' Approach to BGA Cooling

Performance
Pin fin heat sinks generate outstanding cooling power and low pressure drop
Selection
The largest portfolio of copper and aluminum BGA pin fin heat sinks
Innovation
Splayed pin fin heat sinks deliver superior performance
Dimensions
Footprint: 0.3" x 0.3" to 2.5" x 2.5"
Height: 0.2" to 1.1"

The Cool Difference

The Pin Fin Technology

The Pin Fin Technology

  • Outstanding cooling power
  • Low pressure drop
  • Omnidirectional
  • Flexible
Expanded Product Portfolio

Expanded Product Portfolio

  • Heat sinks for BGAs of all sizes
  • Solutions for all airspeeds
  • Cutting edge designs
  • Copper & aluminum
Structural Properties

Structural Properties

  • Manufacturing process: Cold forging
  • Highly conductive forging alloys
  • Parts can be easily modified
  • Bottom surfaces are lapped (superior flatness)

BGA Configurations

 

Splayed Moderate Sparse
Footprint 0.4″ x 0.4″ to 2.5″ x 2.5″ 0.3″ x 0.3″ to 2.5″ x 2.5″ 0.5″ x 0.5″ to 2.5″ x 2.5″
Height 0.3″ to 1.1″ 0.2″ to 1.1″ 0.2″ to 1.1″
Material Copper & aluminum Copper & aluminum Aluminum
Recommended Airspeeds 0 – 600 LFM (0 – 3 m/s) 200 – 1,000 LFM (1 – 5 m/s) 0 – 400 LFM (0 – 2 m/s)
Manufacturing Process Cold forging Cold forging Cold forging
Profiles Square & rectangular Square & rectangular Square
Base Finishing Process Lapping Lapping Lapping
RoHS Compliant Yes Yes Yes
Product Page
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Data Sheets
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A Flexible Technology. A Flexible Approach.

Pin Elimination (complete rows)

Pin Elimination (complete rows)

Multiple Pin Heights

Multiple Pin Heights

Pin Elimination (inner)

Pin Elimination (inner)

Machined Profile

Machined Profile

Comprehensive Modifications

Comprehensive Modifications