Heat Sinks for Embedded Devices > Overview
- Standard heat sinks range from a footprint of 3.0" x 1.5" to a footprint of 8.2" x 8.2"
- Heat sinks are available in aluminum, copper and a hybrid of aluminum and copper
- A large array of highly-powerful pin fin heat sinks is available for single or multiple-device embedded cooling
- The omnidirectional pin fin structure eliminates the need to control the direction of incoming air streams and as a result pin fins are highly suitable for embedded applications
- Standard embedded solutions are available in two distinct designs, each optimized for a specific airspeed environment
- Sparsely configured pin fins are designed for airspeed environments ranging from 0 to 300 LFM (aluminum)
- Moderately configured pin fins are designed for airspeed environments ranging from 100 to 400 LFM (copper and copper/aluminum hybrid)
- Low and very low profile solutions are available for vertically constrained embedded applications
- Highly sophisticated and flexible manufacturing processes allow for a high degree of customization
- Cool innovations' heat sinks are lapped in order to reduce the contact resistance between the heat sink and the device
- A dedicated array of pin fin heat sinks is available for embedded Intel processors
- Standard pin fins for Embedded devices range from a footprint of 3.00" x 1.50" to a footprint of 8.20" x 8.20" and from a height of 0.2" to a height of 1.7"
| Feature | Benefit |
|---|---|
| Round pin fin design | - Outstanding cooling power
- Low pressure drop |
| Omnidirectional structure | - Maximizes air intake
- Eliminates the need to control the direction of incoming airstreams |
| Highly conductive materials | - Additional cooling power due to higher thermal conductivity
- Superior heat spreading capabilities |
| Lapped base finish | - Significantly flatter bases
- Reduced contact resistance between the heat sink and the device |
| Flexible manufacturing | - Allows the provision of custom pin fins (both footprint and height) without any tooling charges |
| Design | Code | Airspeeed (LFM) |
Material | Footprint | Height |
|---|---|---|---|---|---|
| Sparse | M | 0 - 300 | Al | 3.00" x 2.30" - 4.80" x 3.00" | 0.4" - 1.1" |
| Moderate | U | 100 - 400 | Al, Al/Cu | 3.00" x 1.50" - 8.20" x 8.20" | 0.2" - 1.3" |
The information in this page does not take into account any Embedded Intel heat sinks
- Cool Innovations developed highly sophisticated and flexible manufacturing processes that allow for a high degree of customization, generally without the need for any tooling charges or setup costs
- Any physical variable can be customized to meet application specific demands
- In terms of the overall shape, any square, rectangular or any other odd shapes can be provided in order to maximize the space available for cooling purposes
- In terms of height, any required height between the minimum and maximum height of a given heat sink is feasible
- In terms of machining, any standard machining operations is available
- Single or multiple pins can be eliminated
