Heat Sinks for Embedded Devices > Sparse Design
- Designed for low airspeed environments and natural convection cooling (0-300 LFM)
- A widely spaced pin design allows for efficient cooling in low airspeed environments
- Sparsely configured pin fin heat sinks generate substantial cooling power in limited airspeed environments
- The sparse pin fin configuration allows weak incoming airstreams to efficiently enter and exit the pin array, thus providing efficient cooling in low airspeed environments
- The omnidirectional pin fin structure eliminates the need to control the direction of incoming air streams and as a result pin fins are highly suitable for embedded applications
- Cool Innovations is committed to the provision of custom parts in a cost effective fashion, generally without any tooling or setup charges. Customizable parameters include length, width and height
- Cool innovations' heat sinks are lapped in order to reduce the contact resistance between the heat sink and the device
- Sparsely configured pin fin heat sinks range from a footprint of 3.00" x 2.30" to a footprint of 4.80" x 3.00" and from a height of 0.4" to a height of 1.1"
- Sparsely configured pin fin heat sinks for embedded devices are manufactured via the Cold Forging process
- The cold forging process allows for the use of highly conductive aluminum alloys
- The process ensures that no air bubbles, cavities or any other impurities are trapped within the material
- Aluminum pin fin heat sinks are forged from pure aluminum (AL1100)
- The thermal conductivity of AL 1100 is 1510 btu/in ft2 hr of. (~50% higher than AL 380, a common cast alloy)
- Pin fin heat sinks for SM devices are lapped
- The lapping process significantly improves the flatness and the surface finish of the base of the heat sink, when compared to conventional base finishing processes
- The contact resistance between the heat sink and the device is reduced significantly following the completion of the lapping process
- Flatness: Better than 0.001 inch/inch
- Surface Finish: 16 RMS or better
- Anodize - black, hard black, clear, red
- Electroless Nickel (Aluminum and Copper) and Electrolytic Nickel (Aluminum and Copper)
Manufacturing Technology
Materials
Base Finish
Plating (optional)
All heat sinks are 6/6 RoHS compliant
