Heat Sinks for Through Hole Devices > Overview
- A wide array of pin fins are available for TO-220s, TO-247s and similar devices
- "U" & "T'" structures offer unique mounting alternatives for through-hole devices
- Powerful pin fin heat sinks are available for TO-220s, TO-247s and similar devices
- Pin fin heat sinks for TH devices outperform the majority of other heat sink technologies by a substantial margin
- Pin fin heat sinks produce very low thermal resistances due to the round nature of the pins, large surface areas and an omnidirectional configuration
- Solutions are available in three distinct configurations: "T", "U" & "Flat"
- "T" shaped pin fins are designed to cool multiple devices that are mounted on the "leg" of the "T".
- "U" shaped pin fins are designed to cool pairs of devices that are mounted on the "side walls" of the heat sink
- "Flat" pin fins for through-hole devices possess the traditional pin fin structure and are offered with pre-drilled mounting holes
- Highly sophisticated and flexible manufacturing processes allow for a high degree of customization
| Structure | Material | Footprint | Height |
|---|---|---|---|
| U-Shaped | Al | 1.00" x 2.30" - 3.00" x 2.30" | 1.1" - 1.4" |
| T-Shaped | Al | 2.00" x 1.30" - 6.00" x 1.30" | 2.0" - 2.6" |
| Flat | Al, Cu | 1.25" x 0.68" - 2.05" x 1.00" | 0.2" - 1.1" |
